Produits

ELLIPSE EVC chip quality control

ELLIPSE EVC card quality control

Semi-automated chip and biometric sensor implanting

A4 lamination press

Manual GSM - SIM punch

Automated IC - SMD - eSIM programming

Automated desktop IC - SMD - eSIM programming

Automatic module handler

Chip and tag programming with punch

Desktop lamination with punch

3 axis RFID tester

Card vision inspection

Dynamic torsional stress

Dynamic bending stress

Shortened bending

3 wheel test (2 cards 1 axis)

Soft eraser rub test

Card flexure

Sandpaper rub test

Wear test

Card insertion test

Automatic resonance frequency test

3 wheel test

3 wheel test (1 card 2 axes)

3 wheel test (5 cards 2 axes)

3 wheel test (6 cards 2 axes)

ICM adhesion

Peel strength test

Peel strength pre-cutting tool

Three roller IC card test

Tape pull test

Adhesion crosshatch tape

Durability of tipping

Relative height of contacts

Automatic wrapping test

Manual wrapping test (x10)

Manual wrapping test

Card impact fixture

Resistance to impact

Resistance to corner impact

Adhesion of stripe to cards

Bending stiffness

Overall card warpage

Corners

Default ICC holder

Height, width and thickness

Automatic GSM - SIM punch

Automatic chip and biometric sensor punch

Automatic glue tape lamination

Manual chip implanting

Roller pressure

Passport wrapping

Rotary stress

Passport 3 wheels 2 axes (x5)

Passport 3 wheels 2 axes (x1)

MRP Holder

Inlay curvature rectifier

Manual card and biometric sensor milling

Manual glue tape lamination

Manual chip and biometric sensor punch

Bending / Shortened bending

Dynamic torsional & bending stress

Datapage - cover - book warpage evaluation

Peel strength evaluation

Pen stress

Impact stress

Sheet turning stress

Sheet pull stress

Torsion stress

Abrasion stress

Book bend stress

Dynamic bend stress

Embossed character relief height retention pressure