Glue tape lamination
BG INGENIERIE proposes 2 solutions for glue tape lamination, in order to glue hotmelt tape and ACF conductive hotmelt glue on reels of chips and biometric sensors, whatever the dimensions of chips - sensors, for production capacity of up to 10 000 units per hour.
Both solutions offer the possibility to have tape punch prior to lamination.
- Manual glue tape lamination: for R&D, small production and material testing. This unit can be completed by the manual hotmelt tape punch (BGi062B),
- Automatic glue tape lamination: for every day and bigger productions
Equipment suitable for biometric card production.
